Union Semiconductor Files for HKEX Listing, Ranked 2nd in China’s Advanced DDIC Packaging & Testing Sector

NewTimeSpace News: As disclosed by the Hong Kong Stock Exchange, Union Semiconductor (Hefei) Co., Ltd. filed for main board listing on May 29, 2026, with CICC appointed as the sole sponsor.
The company is a semiconductor packaging and testing service provider focusing on advanced packaging and testing solutions for DDIC. Its service portfolio is built around four core process technologies: bumping, wafer testing, glass flip chip and thin-film flip chip. In 2025, the company recorded revenue of RMB 1.783 billion, representing a year-on-year increase of 18.8%, with wafer shipments hitting 511.3 thousand pieces. It stands as the world’s fourth-largest provider of advanced DDIC packaging and testing services. Per Frost & Sullivan data, it ranked second by revenue in mainland China’s advanced DDIC packaging and testing market, and second by 12-inch wafer bump shipments across mainland China’s packaging and testing industry in 2025.

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