AI Chip Concept Stocks Watch | SMIC (00981.HK) down 1.41%, TSMC to raise wafer out prices from January 2027
- On 24 September 2026, supply chain sources said TSMC has decided to adjust its wafer out prices from January 2027 by process and product, with increases of about 3% to 6% and a higher increase for advanced processes such as 2-nanometre and 3-nanometre; TSMC's 8-inch fab capacity utilisation exceeds 100% and order visibility extends to 2030.
- On 24 September 2026, CANYON SEMICONDUCTOR (301660.SZ) opened subscription for its ChiNext listing at an issue price of RMB 12.01 per share, offering 512.646 million shares and planning to raise RMB 7.5 billion; it is the first 12-inch wafer manufacturer in Guangdong province to enter mass production.
- HUAXI SECURITIES believes the upcycle in the computing hardware supply chain is spreading from the main printed circuit board and copper-clad laminate chain to upstream material segments and extending to new segments such as glass substrate packaging and diamond heat dissipation.
NewTimeSpace News, on 24 September 2026, AI chip stocks traded with a correction while SMIC (00981.HK) weakened. As of 13:30, the company quoted HKD 62.900, down 1.41%.
On the news front, on 24 September 2026, supply chain sources said TSMC has decided to adjust its wafer out prices from January 2027 by process and product, with increases of about 3% to 6%, a higher increase for advanced processes such as 2-nanometre and 3-nanometre, while mature and specialty processes will be negotiated individually depending on the product, capacity utilisation and the customer; TSMC did not respond to the market speculation. According to reports, TSMC's 8-inch fab capacity utilisation exceeds 100%, processes below 45 nanometres are fully loaded, 2-nanometre and 3-nanometre processes are in short supply, and capacity for advanced packaging such as CoWoS remains tight, with order visibility extending to 2030. The supply chain also noted that AI demand has spread from GPUs, application-specific chips (ASICs) and high-bandwidth memory (HBM) to mature-process products required by data centres, including power management ICs, microcontrollers, power devices, driver and analog chips, with foundries including Samsung Electronics, Intel and VIS also facing pressure to follow with price increases.
In addition, on 24 September 2026, CANYON SEMICONDUCTOR (301660.SZ) formally opened subscription for its ChiNext listing at an issue price of RMB 12.01 per share, with an initial public offering of 512.646 million shares, a single-account subscription cap of 128,000 shares and planned fundraising of RMB 7.5 billion, making it the ChiNext new share with the largest number of shares issued so far this year. Its prospectus shows that CANYON SEMICONDUCTOR was founded in 2017 and is an integrated circuit manufacturer providing 12-inch wafer foundry services and specialty process solutions to chip design companies at home and abroad, as well as the first 12-inch wafer manufacturer in Guangdong province to enter mass production, with products covering consumer electronics, industrial control, automotive electronics and artificial intelligence.
SMIC (00981.HK) Provides IC wafer foundry and related technical services. It is the largest pure-play wafer foundry in China by capacity and offers the broadest coverage of process nodes. Its mature and select advanced process lines address applications including smart terminals, IoT, and computing chips. Based on its periodic disclosures, wafer shipments, capacity utilization, and revenue are at historically high levels.
HUAXI SECURITIES believes that the upcycle in the computing hardware supply chain is spreading from the main printed circuit board and copper-clad laminate chain to upstream materials such as copper foil, drill needles and electronic cloth, and extending to new segments including glass substrate packaging and diamond heat dissipation, with supply chain value showing structural expansion across multiple points.
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