AI Chip Concept Stock Watch | ASMPT (00522.HK) Fluctuated Higher by Over 5%, Memory Products Remain in an Upward Price Cycle

NewTimeSpace News, on August 13, 2026, the chip theme continued to strengthen, with ASMPT (00522.HK) fluctuating higher. As of 13:28, the company's quote stood at HKD 178.400, up 5.25%.

NewTimeSpace News, on August 13, 2026, the chip theme continued to strengthen, with ASMPT (00522.HK) fluctuating higher. As of 13:28, the company's quote stood at HKD 178.400, up 5.25%.

On the news front, Temasek, the Singapore state investment company, plans to invest in Samsung Electronics and SK Hynix. In addition, the shareholder return plans of the two memory giants have also drawn significant market attention. Data released by China Flash Market shows that as upstream manufacturers' prices rose further in the third quarter, server DDR5 prices rose 15% to 23% this month. TrendForce previously stated that the server DRAM market remains in a supply-shortage situation, and memory suppliers may continue to raise their quotes for the remainder of the third quarter.

CITIC Securities pointed out that the pullback in the share prices of major global memory companies in June–July was not due to weak earnings, but rather a concentrated release of market concerns after the peak in price-increase growth rates. Overall, the Q2 results of the relevant companies were generally in line with expectations; products remain in an upward price cycle, and the revenue share driven by AI data centers continues to rise. Looking ahead, although the magnitude of price increases for memory products is slowing, given that the memory industry will remain in a supply-short-of-demand situation in 2027, this will provide effective support for the gross margins and profitability of companies along the supply chain in the future.

ASMPT(00522.HK)Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

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