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BOCO Electronics：Hong Kong Main Board IPO Application Lapsed, Ranking No.1 in Mainland China High-Performance Compute Server Power Supply Market
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BOCO ElectronicsIPOIPO application lapsed
2026-07-13
HENAN KINGSTAR BREWERY CO., LTD: Hong Kong Main Board IPO Application Lapsed, China’s Largest Flavored Craft Beer Enterprise
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KINGSTAR BREWERYIPOIPO application lapsed
2026-07-13
Zenitar Biotech：Hong Kong IPO Application Lapsed, Core Assets Flonoltinib Maleate and Purinostat Mesylate Under Phase III Registrational Clinical Trials
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Zenitar BiotechIPOIPO application lapsed
2026-07-13
Shanghai Shengsheng Pharmaceutical Cold Chain Technology Co., Ltd.: Hong Kong Main Board IPO Application Lapsed, China’s Largest Temperature-Controlled Supply Chain Service Provider for Pharmaceutical & Life Science Industries
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Shanghai ShengshengIPOIPO application lapsed
2026-07-13
SINO MED Receives Further Supplementary Material Requirements for Overseas Listing Filing, Focusing on Business Involvement of Brain-Computer Interface Technology and Verification of External Participants under Equity Incentive Scheme
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Sino MedicalIPOSupplementary Materials for Filing
2026-07-13
ZEPHYR INTELLIGENT Receives Supplementary Material Requirements for Overseas Listing Filing, Focusing on Historical Nominee Shareholding Verification and Reserved Shares in Employee Shareholding Platform
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ZEPHYR INTELLIGENTIPOSupplementary Materials for Filing
2026-07-13
HAI ROBOTICS Receives Supplementary Material Requirements for Overseas Listing Filing, Focusing on Compliance of Unevaluated Capital Increase & Impact of Work Safety Penalties
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HAI ROBOTICSIPOSupplementary Materials for Filing
2026-07-13
TECDO Receives Supplementary Material Requirements for Overseas Listing Filing, Focusing on Pricing Fairness of New Shareholders and Foreign Investment Compliance
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TecDoIPOSupplementary Materials for Filing
2026-07-13
IMAGE TECH Receives Supplementary Material Requirements for Overseas Listing Filing, Focusing on Historical Capital Contribution Compliance and Progress of Overseas Reinvestment Filing
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IMAGE TECHIPOSupplementary Materials for Filing
2026-07-13
YUANJIE SEMICONDUCTOR Receives Supplementary Material Requirements for Overseas Listing Filing, Focusing on Historical Nominee Shareholding Verification and Consistency of Offering Plan
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YUANJIE SEMICONDUCTORIPOSupplementary Materials for Filing
2026-07-13
ENGINETECH COMPUTER CO., LTD.: Receives Supplementary Material Requirements for Overseas Listing Filing, Focusing on Reasonableness of Capital Reduction & Governance Impacts of Open-End Senior Management Tenures
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Enginetech ComputerIPOSupplementary Materials for Filing
2026-07-13
XTX Refiles HKEX Listing Application, Ranked 5th Globally Among Fabless Code Flash Memory Chip Vendors
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XTXIPOfile a listing application
2026-07-12
ZIYOND PHARMA Submits Main Board Listing Application to HKEX; Ranks No.1 in China for Number of Filed & Approved Topical Dermatological Drugs
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ZIYOND PHARMAIPOfile a listing application
2026-07-09
XTX TECH HKEX Listing Application Lapses Upon Six-Month Expiry; Ranked 6th Globally Among Fabless Code-Type Flash Memory Chip Vendors
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XTX TECHIPOIPO application lapsed
2026-07-09
SIMCERE ZAIMING HKEX Listing Application Lapses Upon Six-Month Expiry; Recorded Most Out-Licensing Transactions Among Chinese Biopharma Firms in 2025
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SIMCERE ZAIMINGIPOIPO application lapsed
2026-07-09
JIWUSIWEI HKEX Listing Application Lapses Upon Six-Month Expiry; Ranked No.1 Among China’s Gastropub Brands for Three Consecutive Years 2022–2024
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JIWUSIWEIIPOIPO application lapsed
2026-07-09
MING YU PHARMA Re-Files HKEX Listing Application; Morgan Stanley, BofA Securities and CITIC Securities Appointed Joint Sponsors
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MING YU PHARMAIPOfile a listing application
2026-07-09
POCO Submits HKEX Listing Application; Ranked No.1 Globally in Alloy Soft Magnetic Powder Core Market
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POCOIPOfile a listing application
2026-07-09
Dtech Technology (01377.HK): Final Offer Price Set at HK$380, Hong Kong Public Offering 354x Oversubscribed
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Dtech TechnologyIPO01377.HK
2026-07-09
EKH Limited (02523.HK): Decides Not to Proceed with Global Offering and Listing, to Refund Application Monies
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EKH02523.HKIPO
2026-07-09
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