INGENIC SEMICONDUCTOR (03223.HK): public offer oversubscribed 685.9 times, margin financing totals HKD 220.95 billion, listing on 25 August

NewTimeSpace News: On 20 August 2026, the subscription period of Ingenic Semiconductor (Beijing Ingenic Semiconductor Co., Ltd., 03223.HK) came to an end. According to market data, as of 10:25 a.m. on 20 August 2026, the margin financing withdrawal amount was HKD 7.31 million, with the remaining margin financing of HKD 1.338 billion after withdrawal, total margin financing of HKD 220.94558 billion, and the public offer oversubscribed by 685.9330 times.

In terms of subscription details, the subscription period ran from 17 to 20 August 2026, with the offer price not exceeding HKD 102.80 per share, in board lots of 100 shares each, and an application fee of HKD 10,383.68; the Hong Kong public offering comprises 3,128,800 H-shares (approximately 10% of the initial global offering). The Company is expected to list on the Main Board of the Stock Exchange on 25 August 2026. 

NewTimeSpace Disclaimer: All content herein is the original work of NewTimeSpace. Any reproduction, reprinting, or use of this content in any other manner must clearly indicate the source as "NewTimeSpace". NewTimeSpace and its authorized third-party information providers strive to ensure the accuracy and reliability of the data, but do not guarantee the absolute correctness thereof. This content is for reference only and does not constitute any investment advice. All transaction risks shall be borne by the user.