Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd. Files HKEX Listing Application, Ranking 3rd Among IC Substrate Manufacturers in Chinese Mainland

NewTimeSpace News: Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd. submitted a Main Board listing application to HKEX on 2 July, with CITIC Securities acting as the sole sponsor. According to Frost & Sullivan data, measured by 2025 revenue, the Company ranks third among IC substrate manufacturers in the Chinese Mainland, and records the highest compound annual growth rate of revenue from 2023 to 2025 among the world’s top 20 IC substrate suppliers, hitting 54.6%.

NewTimeSpace News: Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd. filed its Main Board listing application with HKEX on 2 July 2026, with CITIC Securities appointed as the sole sponsor.

The Company is an IC substrate supplier empowered by smart manufacturing, focusing on the R&D, manufacturing and sales of FCBGA, FCCSP, WBCSP and module substrates. An IC substrate is a specialized high-density interconnection platform for semiconductor packaging, serving as the critical carrier that provides electrical connection, mechanical support and thermal management between silicon chips and printed circuit boards.

Per Frost & Sullivan statistics, based on 2025 revenue, the Company ranks third among IC substrate manufacturers in the Chinese Mainland, up from sixth place in 2023, and also secures the third position among domestic manufacturers for FCBGA and FCCSP substrates respectively. Among the world’s top 20 IC substrate suppliers ranked by 2025 IC substrate revenue, the Company achieves the highest revenue CAGR from 2023 to 2025.

The Company’s revenue surged from RMB1.183 billion in 2023 to RMB2.056 billion in 2024 and RMB2.829 billion in 2025, representing a compound annual growth rate of 54.6%. Its revenue for the first quarter of 2026 reached approximately RMB924 million, a year-on-year increase of 70.9%. Strategically focusing on FCBGA substrates as a core growth driver, the full design capacity of FCBGA substrates at its Shenzhen Park stands at 3,360 thousand pieces in 2025, while the full design capacity of FCCSP, WBCSP and module substrates at its Qinhuangdao Park totals 2,419 thousand pieces.

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