On 9 October 2026, Microintelligence passed the HKEX listing hearing, with Orient Securities International as sole sponsor; 2025 revenue was RMB 795.5 million.
On 30 September 2026, Amicro Technology passed the HKEX listing hearing, with China Securities International and Guotai Junan International as joint sponsors.
On 30 September 2026, the CSRC issued supplementary filing requirements to five companies pursuing Hong Kong listings, covering capital and compliance.
On 29 September 2026, YUDO filed for an HKEX Main Board listing with CICC and CITIC Securities as joint sponsors. It is the world's largest HRS provider.
On 28 September 2026, DSBJ (002384.SZ) said it received the CSRC filing notice for its planned HK listing of up to 234,038,600 H Shares.
On 24 September 2026, Orbbec Inc. filed for a Main Board listing on the HKEX, with Goldman Sachs (Asia) and Haitong International as joint sponsors.
On 21 September 2026, DYNAMIC ELECTRONICS (603175.SH) filed for a Main Board listing on HKEX; 2025 revenue was RMB 4,752.3 million, with a 14.0% CAGR since 2023.
On 18 September 2026, the International Department of the CSRC issued supplementary material requirements for MEIKESHENG ENERGY's overseas listing filing, covering six items including outbound investment procedures, state-owned shareholder identification, and equity incentive plan compliance.
On 18 September 2026, the International Department of the CSRC issued supplementary material requirements for SINOCELLTECH's overseas listing filing, covering six items including outbound investment procedures, all outstanding litigation, the rationale for the Hong Kong listing, and its property management operations.
On 18 September 2026, the International Department of the CSRC issued supplementary material requirements for DAQIN ENERGY STORAGE's overseas listing filing, covering six items including pricing of shareholders added in the last 12 months and the controlling shareholder's historical shareholding entrustment.
On 20 August 2026, the CSRC issued a filing notice for the overseas listing and "full circulation" of Jiangsu Xinde Semiconductor Technology Co., Ltd., covering up to 367,640,500 overseas-listed ordinary shares and the conversion of 693,909,187 domestic unlisted shares held by 51 shareholders.
On 18 September 2026, Shenzhen Transsion Holdings Co., Ltd. (688036.SH) announced that the Listing Committee of HKEX held a listing hearing on 17 September 2026 to consider its application for the issue of overseas-listed foreign shares (H shares) and listing on the Main Board of HKEX, and that its sponsor received a letter from HKEX on 18 September 2026 stating that the Listing Committee has reviewed its listing application.
On 17 September 2026, Transwarp Technology (Shanghai) Co., Ltd. (06727.HK) announced that the Offer Price for its Global Offering has been determined at HK$49.00 per H Share, with dealings in the H Shares expected to commence at 9:00 a.m. on 21 September 2026 on the Main Board of the Stock Exchange in board lots of 100 H Shares under stock code 6727.
On 16 September 2026, the Hong Kong public offering of Transwarp Technology (Shanghai) Co., Ltd. (06727.HK) closed, with margin financing reaching about HKD 2.304 billion as at 12:16 p.m., equivalent to about 53.90 times oversubscription based on the public offer portion of about HKD 42.74 million; the Company plans to offer 14,010,800 H shares at HKD 49.00 to HKD 61.00 per share, with listing on the Main Board of HKEX expected on 21 September 2026.
On 15 September 2026, CCTECH (300604.SZ) announced that the twentieth meeting of the fourth session of its board of directors held on 14 September 2026 considered and approved the resolutions relating to the issue of H Shares and listing on The Stock Exchange of Hong Kong Limited, and that the Company intends to issue H Shares and apply for listing on the Main Board of the Hong Kong Stock Exchange.
On 13 September 2026, RoboTechnik Intelligent Technology Co., Ltd. published a PHIP on the website of the Stock Exchange seeking the listing of its H shares on the Main Board, with Huatai Financial Holdings (Hong Kong) Limited, Citigroup Global Markets Asia Limited and Orient Capital (Hong Kong) Limited as joint sponsors; the filing shows revenue of RMB 1,569.6 million, RMB 1,104.2 million and RMB 948.8 million for 2023, 2024 and 2025 respectively, an annual loss of RMB 45.0 million in 2025, and revenue of RMB 198.6 million and a loss of RMB 74.7 million for the four months ended 30 April 2026; by 2025 revenue the Company ranked first globally in silicon photonics smart manufacturing equipment with a 20.5% market share. The Company's A shares are listed on the ChiNext Market of the Shenzhen Stock Exchange (300757.SZ).
