AI Chip Concept Stocks Insight | ASMPT (00522.HK) down 11.68%, IDG reported as lead bidder for SMT unit
- The SMT deal may close within weeks at over USD 1 billion, possibly below the company's USD 1.5 billion target.
- ASMPT runs semiconductor solutions and surface mount technology segments; the former supplies advanced packaging and photonics tools.
- TrendForce expects Q4 PC DRAM contract prices to rise 13% to 18%, supporting packaging equipment orders.
NewTimeSpace News, on 5 November 2026, AI chip stocks traded mixed, and ASMPT (00522.HK) weakened. As of 13:16, the company quoted HKD 99.450, down 11.68%.
On the news front, on 3 November 2026 media reports indicated that IDG Capital has emerged as the leading bidder for ASMPT's surface mount technology (SMT) business, with a deal possibly reached within weeks and the unit valued at more than USD 1 billion, potentially below the company's earlier target of USD 1.5 billion.
In addition, on 5 November 2026 data from TrendForce's DRAMeXchange showed that the average contract price of mainstream DRAM (DDR4 8Gb) reached USD 27.5 in October, up 5.77% month on month and about 9.5 times the USD 2.9 level when tracking began in June 2016; the firm expects PC DRAM contract prices to rise 13% to 18% in the fourth quarter, attributing the increase to memory makers prioritising new capacity for server memory and squeezing PC supply. The pace of server and high-bandwidth memory expansion directly shapes order intensity for advanced packaging tools such as thermo-compression bonders.
MORGAN STANLEY believes the company's long-term growth prospects remain favourable, with emerging opportunities in EMIB-T, CoPoS and photonics providing momentum, though industry headwinds may cap near-term upside.
CAITONG SECURITIES believes that AI compute investment is driving demand for advanced packaging and photonics equipment, with order visibility and the book-to-bill ratio improving together, and AI-related revenue expected to keep growing in 2027.
ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.
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