AI Chip Concept Stocks Insight | ASMPT (00522.HK) up 1.90%, NVIDIA unveils next-generation co-packaged optics

NewTimeSpace News, on 2 November 2026, AI chip stocks firmed, and ASMPT (00522.HK) rose. As of 13:15, the company quoted HKD 107.000, up 1.90%.

On the news front, the company has no recent news of its own; within the sector, on 31 October 2026 media reports indicated that NVIDIA showcased a next-generation co-packaged optics prototype at SEMICON West 2026 in San Francisco, named OOI (Optics-on-Interposer), which integrates the optical engine directly onto the silicon interposer carrying the GPU and further shortens the distance between optical-electrical conversion and the compute die; NVIDIA said it has obtained prototype samples but has not announced a commercialisation timetable. Integrating optical engines into the interposer places higher demands on high-precision bonding and advanced packaging, which bears directly on ASMPT's photonics and hybrid bonding equipment business.

CMS believes that the company's third-quarter bookings hit a record high, with demand for advanced packaging and photonics continuing to be released and bookings at its thermo-compression bonding, photonics and surface mount businesses all setting records; while some HBM investment has been deferred, demand for new capacity and selective upgrades remains, and the company is advancing validation of next-generation thermo-compression bonding tools and panel-level packaging.

ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.