AI Chip Concept Stocks Insight | ASMPT (00522.HK) down 2.03%, NVIDIA to lift advanced packaging capacity over 300% by 2028
- NVIDIA and Amkor's multi-year agreements now total USD 3 billion.
- NVIDIA plans to lift substrate capacity to 2.5 times the current level in three years.
- BofA Securities sees back-end packaging and test equipment supply chains as significant beneficiaries.
NewTimeSpace News, on 23 October 2026, AI chip stocks traded mixed, and ASMPT (00522.HK) weakened. As of 13:30, the company quoted HKD 120.600, down 2.03%.
On the news front, on 21 October 2026 NVIDIA announced a multi-year capacity expansion agreement worth USD 1.3 billion with Amkor Technology, funding the expansion of Amkor's advanced packaging lines in South Korea, with the two sides planning to lift interposer wafer capacity by more than 300% by the end of 2028; combined with their earlier project in Arizona, the total value of the multi-year agreements between the two has risen to USD 3 billion. The advanced packaging build-out will directly lift procurement of packaging equipment such as thermo-compression bonders.
In addition, on 21 October 2026 NVIDIA also announced expanded global manufacturing capacity with supply chain partners including IBIDEN, KYEC, Samsung Electro-Mechanics, SPIL and Unimicron, covering substrates, advanced packaging, semiconductor test and optical engines, with substrate capacity planned to rise to 2.5 times the current level in three years and semiconductor test capacity to double between 2026 and 2027.
BofA Securities believes that NVIDIA's demand is exceptionally strong but capacity is the main constraint, and that the company is pushing packaging, test and co-packaged optics expansion with unprecedented force, leaving back-end packaging and test equipment supply chains as significant beneficiaries.
ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.
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