AI Chip Concept Stocks Insight | ASMPT (00522.HK) down 3.62%, advanced packaging to top 50% of OSAT market in 2026

NewTimeSpace News, on 20 October 2026, AI chip stocks pulled back, and ASMPT (00522.HK) weakened. As of 13:40, the company quoted HKD 133.000, down 3.62%.

On the news front, on 20 October 2026 ASMPT announced that its group chief financial officer has been appointed an executive director of the company with effect from 19 October 2026, with annual remuneration unchanged and no directors' fee payable for the appointment.

In addition, on 19 October 2026 industry data showed that advanced packaging will account for more than 50% of the overall OSAT market in 2026; TSMC's CoWoS capacity is planned to reach 120,000 to 140,000 wafers per month by the end of 2026, yet advanced packaging capacity will still fall 10% to 20% short this year.

SINOLINK SECURITIES noted that demand for TSMC's advanced packaging remains strong and growing, and that supply stays short of demand even with annual capacity expansion, so the structural gap in advanced nodes and advanced packaging will persist and pull through demand for upstream semiconductor equipment and materials.

SCS said it is positive on high growth in semiconductor equipment orders and profit next year, with domestic components being adopted faster amid shortages.

ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.