AI Chip Concept Stocks Watch | ASMPT (00522.HK) down 3.79%, GlobalFoundries and TSMC sign USD 2 billion silicon interposer deal

NewTimeSpace News, on 9 October 2026, AI chip shares traded with volatility while ASMPT (00522.HK) weakened. As of 13:40, the company quoted HKD 157.600, down 3.79%.

On the news front, on 8 October 2026, GlobalFoundries announced a multi-year manufacturing agreement with TSMC to establish a supply of silicon interposers in the United States for TSMC's CoWoS advanced packaging ecosystem. Under the agreement, GlobalFoundries will provide manufacturing services to TSMC and expand capacity at its Malta, New York facility, with a total deal size of about USD 2 billion and an initial term of five years, providing a framework for future capacity expansion; GlobalFoundries thereby becomes the first US supplier of silicon interposers for advanced packaging, and the agreement also supports related technologies including embedded deep trench capacitors, with volume production expected to ramp in the first half of 2028. A silicon interposer is a layer of silicon beneath processors and memory chips that carries the wiring needed to transmit electronic signals and power, enabling high-speed communication between chips, and is an indispensable base material in CoWoS packaging. Reports noted that interposer manufacturing is only one part of the CoWoS-S production flow: bonding logic chips and high-bandwidth memory stacks to the interposer, assembling the resulting structure onto an organic substrate and carrying out electrical testing still require specialised capabilities such as high-precision bonding equipment, which the agreement between the two companies does not cover.

In addition, on 8 October 2026, TSMC released its September 2026 revenue report, with consolidated revenue of about NTD 511.857 billion for the month, down 0.6% month on month and up 54.6% year on year; cumulative consolidated revenue for January to September was about NTD 3,898.727 billion, up 41.1% year on year and already exceeding its full-year 2025 revenue; third-quarter revenue was about NTD 1,494.243 billion, up about 17.6% quarter on quarter and 50.9% year on year, a record quarterly high. According to analysts, strong artificial intelligence demand together with a pick-up in stocking for new smartphone models was the main driver of the record third-quarter revenue; as 2-nanometre capacity gradually ramps, the market expects fourth-quarter revenue to rise further, while global cloud service providers continue to expand AI infrastructure investment, pushing up demand for 3-nanometre and 5-nanometre advanced processes and advanced packaging.

EBSCN believes that fields with core technological barriers and localisation logic, such as semiconductors and artificial intelligence, benefit both from the upcycle in the global technology industry and from national policy support for technological innovation and self-reliance, offering relatively strong growth certainty and valuation elasticity.

OPEN SOURCE SECURITIES believes that upward revisions to capital expenditure for advanced memory and logic expansion will accelerate the recovery in demand for semiconductor equipment.

ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

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