AI Chip Concept Stocks Watch | ASMPT (00522.HK) up 0.06%, advanced packaging capacity stays in short supply

NewTimeSpace (newtimespace.com) News, on 15 September 2026, AI chip stocks traded with volatility while ASMPT (00522.HK) strengthened. As of 14:19, the company quoted HKD 154.400, up 0.06%.

On the news front, media reports on 15 September indicated that, as the third quarter enters its final stretch, wafer foundry and advanced packaging capacity remains in short supply. Supply chain sources said NVIDIA, Apple and others continued to occupy TSMC's advanced process and packaging resources; Amazon Web Services recently stepped up tape-outs of its in-house AI chips, with its Annapurna unit securing more 3nm capacity; and MediaTek, beyond smartphone chips, is competing for 2/3nm process and CoWoS-S/L capacity on the back of large Google TPU-related orders.

In addition, Samsung Electronics and Qualcomm have further expanded their semiconductor cooperation into 2.1D advanced packaging, aiming to provide higher-density, higher-speed chip interconnect solutions for next-generation high-performance computing and AI chips. Unlike 2.5D packaging, which relies on a silicon interposer, 2.1D packaging uses high-density fine-line circuitry on advanced packaging substrates to connect different chips directly, striking a new balance between performance and cost. Samsung Electro-Mechanics recently showcased 2.5D and 2.1D packaging substrates for AI accelerators, with the 2.5D solution focused on warpage issues in large-size, high-layer-count substrates and the 2.1D solution achieving direct chip-to-chip connection without a silicon interposer; Samsung is also advancing technologies including glass substrates and 3D packaging.

KAIYUAN SECURITIES noted that AI infrastructure is driving upward revisions to global semiconductor capital expenditure, with total global semiconductor manufacturing equipment sales projected to reach USD 169.2 billion in 2026, up 26% year on year, of which global IDM and fab capital expenditure will rise 27% year on year and planned investment in advanced packaging lines 25% year on year in 2026; by segment, sales of global wafer fabrication, packaging and test equipment are forecast to post compound annual growth rates of 23.3%, 27.0% and 27.8% respectively from 2025 to 2028, with back-end equipment growth significantly outpacing the front end, and the global thermo-compression bonding (TCB) equipment market to grow at a compound annual growth rate of 29% under a neutral assumption. GUOSEN SECURITIES noted that, as AI-driven R&D automation accelerates, computing demand no longer depends solely on the scale of a single frontier pre-training run, and the joint expansion of training and research inference will keep lifting the ceiling on computing demand, with computing chips, HBM, memory and advanced packaging among the segments to watch in the AI supply chain; the 15th Five-Year Plan for the development of the electronic information manufacturing industry, jointly issued by the Ministry of Industry and Information Technology and the National Development and Reform Commission, proposes that by 2030 revenue of industrial enterprises above designated size in China's electronic information manufacturing industry exceed RMB 30 trillion, with breakthroughs in edge intelligent computing chips and high-end memory chips and the development of new architectures such as near-memory computing and compute-in-memory.

ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

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