CICC (03908.HK): Corporate Bond "25 CICC G3" to Pay Interest on August 26
NewTimeSpace News: On August 19, 2026, CICC (03908.HK) issued an overseas regulatory announcement, noting that the second tranche of its corporate bonds publicly issued to professional institutional investors in 2025 (bond short name: 25 CICC G3, code: 243670.SH) will distribute interest on August 26, 2026.
The coupon rate of this bond is 1.90%. Each lot has a face value of RMB 1,000, with distributable interest of RMB 19.00 (tax inclusive). The record date is August 25, 2026, and the interest payment date falls on August 26, 2026.
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