NewTimeSpace Flash — 21 Jan, 10:40 am
Semis strike again: advanced-packaging and memory-chip buckets lead the charge. Loongson hits 20 % limit-up, Hygon surges >13 % to fresh highs, Jianghua Micro grabs its third straight daily limit, and Montage Semiconductor & TFME both leap >8 %.

Global X China Semiconductor ETF(03191.HK) rallies 2.95 %, taking its YTD gain to nearly 20 %. Listed in Hong Kong and run by Global X’s Korea team, it is the only HKEX-traded ETF that bets purely on the full-stack China-semiconductor complex.

Third-quarter portfolio data show a 100 % on-shore semiconductor sleeve; top-10 holdings—North Huachuang, SMIC, Montage, AMEC, Guoxin Micro, etc.—span the entire wafer-to-package chain, avoiding the consumer-electronics or software “dilution” common in broader tech ETFs.

TrendForce projects Q1-26 contract prices to jump 55-60 % for mainstream DRAM and 33-38 % for NAND. Meanwhile, a Micron director just bought US$7.8 m of stock—the first insider purchase since 2022—signalling management confidence in a memory rebound. Outsourced assembly & test houses are also raising prices on tight capacity and rising material costs.

CITIC Securities Securities notes that geopolitical friction is opening a substitution window for domestic semiconductors; new-gen compute chips from Huawei, Cambricon and Hygon are delivering rapid performance gains and an improving ecosystem. (Source: CITIC Securities, 21 Jan 2026, “Bullish on China Semiconductor Equipment, OSAT & Memory Chain Investment Opportunities”.)

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