AI Chip Concept Stocks Insight | ASMPT (00522.HK) up 4.10%, NVIDIA to fund SPIL's CoWoS expansion
- NVIDIA plans to invest billions of US dollars to help SPIL, a subsidiary of ASE Technology Holding, expand CoWoS capacity, with the money going to cleanrooms and production equipment.
- ASMPT's thermo-compression bonding tools are already used by leading OSATs, IDMs and memory makers for volume production of HBM and chiplet-based chips.
- Yole Group expects the advanced packaging market to exceed conventional packaging for the first time in 2026, with related capital expenditure approaching USD 28 billion.
NewTimeSpace News, 10 November 2026, the AI chip theme performed strongly, with ASMPT (00522.HK) strengthening. As of 13:19, the company quoted HKD 96.400, up 4.10%.
On the news front, the company has no recent news of its own; within the sector, on 8 November 2026, media reports indicated that NVIDIA plans to invest billions of US dollars to support SPIL, a subsidiary of ASE Technology Holding, in expanding CoWoS advanced packaging capacity, with the funds to be used for cleanroom construction and production equipment procurement; the same report cited Yole Group's forecast that the advanced packaging market will exceed conventional packaging for the first time in 2026, with related capital expenditure approaching USD 28 billion.
TFSECURITIES believes that advanced packaging can lift the value content of a single chip by 30% to 50%, and that the value chain of the packaging and testing industry is being restructured.
GUOYUAN SECURITIES believes that, against a backdrop of pressure on overseas artificial intelligence valuations, the domestic semiconductor manufacturing chain has been relatively strong, and that policy support and technology breakthroughs are expected to drive continued growth in computing, memory, manufacturing and packaging demand; global semiconductor sales reached USD 517.7 billion in the third quarter of 2026, up 24.1% quarter on quarter.
ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.
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