Ligent Technologies passes HKEX hearing; fifth-largest professional optical module maker globally with integrated optical chip capabilities

NewTimeSpace News: On 30 August 2026, Ligent Technologies, Inc. passed the HKEX listing hearing. The Company is an established supplier of optical communications and optical connectivity products, dedicated to the R&D, manufacturing and sale of optical modules, optical chips and optical network terminals for domestic and overseas customers. In 2025, by global optical module revenue, the Company held a 4.0% market share, ranking fifth among all professional optical module manufacturers worldwide; by China optical module revenue, it held a 10.1% market share, ranking third among all professional optical module manufacturers globally. As of the last practicable date, the Company is also one of the few enterprises worldwide with both optical module and optical chip R&D and production capabilities.

In optical modules, in the data communications segment, the Company is one of the first optical module manufacturers in China to successfully develop and mass-produce 800G and 1.6T optical modules, and is actively researching next-generation 3.2T optical modules and 6.4T optical engines; it has successfully developed and commenced mass production of optical modules based on linear-drive pluggable optics (LPO) and linear-receive optics (LRO) in 2025 and the first quarter of 2026 respectively. As of the last practicable date, the Company has achieved initial commercialization of external laser small form factor pluggable (ELSFP) light source modules supporting near-package optics (NPO) and co-packaged optics (CPO) technologies, delivered 3.2T NPO optical engine samples for customer verification, and is jointly developing 6.4T NPO optical engines and next-generation 12.8T ultra-high-density pluggable optics (XPO) optical modules with customers. In the telecommunications segment, FTTx optical modules have been an important segment maintaining the Company's strong market position, and the Company is one of the first optical module manufacturers globally to successfully develop 50G passive optical network (PON) optical modules.

In optical chips, the Company has developed and produced DFB laser chips, including 75mW and 100mW high-power continuous wave (CW) DFB laser chips, and is currently developing 150mW/400mW CW-DFB laser chips; it has developed 100G EML laser chips and is developing 200G EML and 400G indium phosphide (InP) laser chips. The Company is also one of the first manufacturers in China to successfully develop and produce 10G EML laser chips, and is developing 50G EML laser chips for PON optical modules in the FTTx market. In optical network terminals, the Company focuses on broadband access (mainly optical network terminal boxes) and Wi-Fi coverage products, having mass-produced optical network terminals covering all mainstream and common rates in accordance with the latest industry standards, and is developing FTTR+X gateways with computing capabilities and AI-integrated smart terminals with edge computing capabilities (expected to complete development and commence delivery in the third quarter of 2026).

In terms of R&D, as of the last practicable date, the Company holds 1,581 patents and 716 pending patent applications globally, is an initiator or member of 18 industry standardization organizations, and has participated in the formulation of 61 industry standards. Through its cross-regional R&D network in Qingdao, Wuhan, Silicon Valley and Singapore, the Company has accumulated core technologies and products covering all major segments of the optical communications value chain, with proprietary capabilities in circuit design and core packaging technologies for optical modules, including transistor outline (TO-CAN), BOX, chip-on-board (COB) and silicon photonics packaging technologies, and has successfully developed two mature fabrication platforms for buried heterostructure and ridge waveguide.

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