AI Chip Concept Stocks Watch丨ASMPT (00522.HK) Falls Nearly 10%, Overnight US Semiconductor and Memory Stocks Extend Losses

NewTimeSpace (newtimespace.com) reported that on July 17, 2026, the semiconductor theme in Hong Kong stocks continued to weaken, with ASMPT (00522.HK) extending its decline. As of 13:38, the stock was quoted at HKD 159.900, down 9.92%.

NewTimeSpace (newtimespace.com) reported that on July 17, 2026, the semiconductor theme in Hong Kong stocks continued to weaken, with ASMPT (00522.HK) extending its decline. As of 13:38, the stock was quoted at HKD 159.900, down 9.92%.

On the news front, overnight US stocks saw semiconductor, memory, and optical communication concept names extend their declines, with the Philadelphia Semiconductor Index closing significantly lower, down over 4%. Additionally, Google shares plunged sharply during trading amid market chatter that the release of its flagship model, Gemini 3.5 Pro, had been delayed and that its programming capabilities fell short of expectations, raising market concerns over Google's competitiveness in AI.

Bohai Securities stated that on the AI computing front, leading domestic large model companies are deepening collaborative development between chips and models, leveraging domestic computing chips as the core computing foundation for model inference. The Ascend 950 superserver node is set to make its physical debut at the World Artificial Intelligence Conference, and the accelerated deployment of domestic superserver nodes is expected to help meet large‑scale inference computing demand. Capital expenditure by domestic cloud vendors is picking up, and the share of domestic computing power in total investment is expected to gradually rise. Computing power leasing and IDC providers are likely to benefit significantly from the construction and expansion of new intelligent computing centers.

ASMPT (00522.HK)Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

NewTimeSpace Disclaimer: All content herein is the original work of NewTimeSpace. Any reproduction, reprinting, or use of this content in any other manner must clearly indicate the source as "NewTimeSpace". NewTimeSpace and its authorized third-party information providers strive to ensure the accuracy and reliability of the data, but do not guarantee the absolute correctness thereof. This content is for reference only and does not constitute any investment advice. All transaction risks shall be borne by the user.

×
Share to WeChat

Open WeChat, use the "Scan", and share to my Moments.