AI Chip Concept Stocks Watch | ASMPT (00522.HK) down 3.28%, hybrid bonding technology reaches first mass production in mobile chips

NewTimeSpace News, on 14 October 2026, AI chip shares traded with a correction while ASMPT (00522.HK) weakened. As of 13:35, the company quoted HKD 153.200, down 3.28%.

On the news front, the company has no recent news of its own; within the sector, on 13 October 2026, Huawei held a Kirin chip technology briefing in Shanghai, where Xu Songyu, head of product management for wireless terminal chips at Huawei's semiconductor business, disclosed that the Kirin 9050 series chips have entered successful mass production and that the series is the first to commercialise "logic folding" technology. Rather than simply stacking multiple dies, the chip is designed from the outset from a three-dimensional perspective, coordinating the logic circuit layout with multiple dies to shorten signal routing and raise transistor density: the chip contains more than 50 million hybrid bonds and over 5 million effective signal interconnects, with transistor density up 53.5%, while the Kirin 9050 Pro delivers a 41% improvement in CPU large-core energy efficiency and a 140% increase in NPU computing power. The hybrid bonding pitch currently stands at 1.5 micrometres, which Huawei plans to reduce to 1 micrometre in 2027, and samples of the next-generation Kirin 2027 chip are already under testing.

In addition, on 13 October 2026, Barclays' memory market research report showed that, as of October 2026, contract prices for DDR4 memory chips rose 4% month on month and 24% over the past three months, while DDR5 contract prices rose 3% month on month and 20% over three months, with the older specification outpacing the newer one. The report noted that the persistent memory shortage is prompting manufacturers to adopt longer-term supply agreements, but that the pricing mechanism in such agreements is moving closer to real-time market supply and demand, weakening the previously set price floors and ceilings and shifting pricing risk to buyers. Separate market research forecasts that the overall supply gap in the DRAM and NAND flash markets will persist until 2028, with DRAM supply-demand imbalance peaking in the fourth quarter of 2027 at a 13.9% shortfall and the NAND gap topping out in the first quarter of 2028 at 8.3%. As manufacturers prioritise more capacity for DRAM lines needed for high bandwidth memory (HBM), capacity constraints on NAND flash are further aggravated.

GUOYUAN SECURITIES believes that the AI hardware chain is undergoing a phase of correction, and that investors may prioritise watching the validation of prosperity in the storage and advanced packaging segments.

J.P. MORGAN believes that AI infrastructure investment remains at a high level, that the semiconductor supply chain is broadly tight on supply, and that the cyclical recovery in non-AI end markets is broadening, with third-quarter results for most covered companies expected to be solid and fourth-quarter and 2027 guidance biased to the positive; the market's focus this quarter will shift from well-recognised demand strength towards supply-side constraints, with bottlenecks in advanced-node foundry, memory and advanced packaging, as well as the pace of new capacity release, being the key variables. The bank maintains an overweight stance on the semiconductor equipment sector and expects the global wafer fab equipment market to grow 31%, 38% and 17% year on year in 2026, 2027 and 2028 respectively.

ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.