AI Chip Concept Stocks Watch | ASMPT (00522.HK) up 2.03%, Intel teams up with AUO on Micro LED substrate advanced packaging

NewTimeSpace News, on 22 September 2026, AI chip shares traded with volatility while ASMPT (00522.HK) strengthened. As of 13:43, the company quoted HKD 170.800, up 2.03%.

On the news front, on 21 September 2026, media reports said Intel is working with AU Optronics to develop Micro LED substrate advanced packaging technology, targeting co-packaged optics (CPO) and high-density computing chip integration. The reports said the technical anchor of the collaboration is a granted US patent held by Intel, "IC Package with Micro LEDs", whose core design embeds a semiconductor chip at least partly within a glass substrate and establishes electrical coupling with the chip through a through-glass via (TGV) to power the Micro LED, enabling on-chip light-emitting display, customised light effects and in-situ photoelectric testing without additional external components. The reports also noted that in addition to continuing to advance its embedded multi-die interconnect bridge (EMIB) technologies, Intel has introduced glass substrate solutions featuring high flatness, high temperature resistance, a low coefficient of thermal expansion and low signal loss, in order to handle the continuously rising high-density interconnect requirements of AI chips.

In addition, on 21 September 2026, media reports said Samsung Electronics plans to at least double its output of HBM4-series products in 2027, covering the sixth-generation high-bandwidth memory HBM4 and the subsequent HBM4E. According to the reports, Samsung plans to increase outsourced glass-carrier cleaning volumes to about 50,000 sheets a month next year from about 20,000 this year, versus only about 10,000 a month in 2025; glass carriers are temporary materials used to support thinned DRAM wafers in HBM production and can be cleaned and reused. The industry expects Samsung's average monthly HBM wafer input to rise to about 250,000 next year from about 180,000 this year, with the HBM4 series rising to about 80% of its HBM shipments from about 40% this year.

CHINA GALAXY SECURITIES believes that AI computing build-out continues to drive HBM demand upward, that Nvidia's next-generation Rubin Ultra platform lifts HBM capacity per GPU to 384GB, and that combined with rising AI ASIC shipments HBM demand will see a new leap; it expects HBM wafer input as a share of total DRAM wafer input to rise from 18% in 2025 to 30% in 2027, with the bit-supply share increasing in tandem, and views 3D-stacked DRAM as the core technology route to breaking the memory wall. CAITONG SECURITIES believes the HBM upcycle will continue, estimating a compound annual growth rate of about 55.7% in global HBM capacity demand from 2025 to 2028, with HBM supply remaining structurally tight through 2028; AI servers are the core source of HBM demand, HBM content per AI server continues to grow, and expanding computing capital expenditure will drive demand across the entire supply chain including cleanrooms, wafer manufacturing, HBM packaging and testing and test equipment.

ASMPT (00522.HK) Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

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