LINUO PACKAGING (301188.SZ): files for listing on HKEX: No.2 in Heat Glass
- LINUO PACKAGING focuses on the development, manufacturing and sales of borosilicate pharmaceutical glass packaging and heat-resistant glass for daily use, serving the pharmaceutical, biotechnology, food and beverage and household sectors; it developed China's first hexagonal stepped all-electric glass melting furnace.
- In June 2026, the pilot furnace at its glass new materials innovation incubation centre was ignited and preliminary trial production of glass substrates for semiconductor packaging commenced; as at the latest practicable date, the Company has begun providing glass substrate samples to semiconductor packaging industry participants for testing.
NewTimeSpace News: On 28 September 2026, Shandong Linuo Pharmaceutical Packaging Co., Ltd. (stock code: 301188.SZ) filed an application with the Hong Kong Stock Exchange for a listing on the Main Board, with China Merchants Securities International and Lego Financial Group as joint sponsors. The Company is a borosilicate specialty glass supplier focusing on the development, manufacturing and sales of borosilicate pharmaceutical glass packaging and heat-resistant glass for daily use, with products used in the pharmaceutical, biotechnology, food and beverage and household industries.
According to Frost & Sullivan, based on 2025 sales revenue, the Company ranked ninth among pharmaceutical glass packaging suppliers in China with a 2.4% market share, and ranked first in China and second globally in the heat-resistant glass for daily use market, with market shares of 9.5% and 5.1%, respectively. The Company developed China's first hexagonal stepped all-electric glass melting furnace, leveraging its R&D capabilities in furnace design and glass melting technology.
During the track record period, the Company's products were sold to customers in about 60 countries and regions in the Americas, Asia and Europe. The Company has made strategic investments in the development of glass substrates for semiconductor packaging; in June 2026, the pilot furnace at its glass new materials innovation incubation centre was ignited and preliminary trial production of glass substrates for semiconductor packaging began, and as at the latest practicable date, the Company has begun providing glass substrate samples to semiconductor packaging industry participants for testing.
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