Qunce Technology Files for HKEX Listing, Targeting "The First FCBGA Substrate Stock"
NewTimeSpace News: As disclosed by HKEX, Suzhou Qunce Technology Co., Ltd. filed its Main Board listing application with the Hong Kong Stock Exchange on June 8, 2026, targeting "the first FCBGA substrate stock", with CITIC Securities serving as the sole sponsor.
Qunce Technology is a leading supplier of advanced IC packaging substrates in Chinese mainland, focusing on the R&D, production and sales of IC substrates. According to Frost & Sullivan data, by 2025 revenue, the company ranked first in both the Chinese mainland FCBGA (Flip Chip Ball Grid Array) substrate market and FCCSP (Flip Chip Chip Scale Package) substrate market, with market shares of 25.3% and 13.4% respectively.
It is the first manufacturer in Chinese mainland with full and comprehensive IC substrate production capacity at a single production base, and also the first enterprise dedicated to assisting domestic clients in achieving mass production of FCBGA substrates. Its products are widely used in AI servers, high-speed computing, data centers, smart devices, automotive electronics, industrial control and other fields.
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