Lens Technology (06613.HK): Wholly-Owned Subsidiary Signs MOU with Intel; Focuses on TGV Advanced Packaging Technology

NewTimeSpace News: Lens Technology (6613.HK) announced on July 24 that its wholly-owned subsidiary Lens International recently signed a cooperation MOU with Intel Corporation, with TGV advanced packaging as the key discussion direction. The Parties will discuss and evaluate potential cooperation on key processes including glass substrate via formation, high-precision laser processing, metallized via deposition, and multi-layer interconnect routing, and will also explore cooperation opportunities in AI PC structural components, data center server components, and embodied intelligent robots. Most provisions of the MOU are not legally binding, and whether subsequent formal agreements can be signed involves significant uncertainty. As of the announcement date, the TGV advanced packaging business has not had a material impact on operating performance.

NewTimeSpace News: Lens Technology Co., Ltd. (stock code: 6613) announced on July 24 that its wholly-owned subsidiary has signed a cooperation memorandum with Intel Corporation.

According to the announcement, the Board is pleased to announce that the company's wholly-owned subsidiary Lens International (Hong Kong) Limited ("Lens International") recently signed a cooperation memorandum ("MOU") with Intel Corporation (stock code: NASDAQ: INTC) ("Intel"). Lens International and Intel are collectively referred to as the "Parties".

The announcement stated that the Parties will focus on TGV advanced packaging as the key direction under this MOU, with Intel viewing Lens International as a valuable potential partner in this field. The Parties will discuss and evaluate potential cooperation related to key processes including glass substrate via formation, high-precision laser processing, metallized via deposition, and multi-layer interconnect routing (including but not limited to the above), with Intel providing illustrative architecture information, design for manufacturability (DFM) guidelines, benchmark testing methods, and validation methods. All of the above items require separate written agreements, and any engineering validation, certification, or mass production activities shall be defined in separate written agreements and subject to such agreements.

The announcement disclosed that in addition to TGV, the Parties believe there is meaningful exploration potential in other areas of complementary strengths, such as: AI PC structural components and modules, data center server high-reliability structural components and thermal components, as well as embodied intelligent robots, industrial intelligent equipment, and edge computing hardware. The Parties will discuss these opportunities as they arise, and any such cooperation (if any) will proceed under separately signed written agreements.

The announcement also noted that except for provisions related to intellectual property, confidentiality and public statements, dispute resolution, liability limitations, and applicable law which are legally binding, other provisions of the MOU do not constitute commitments to enter into any transaction or achieve any specific commercial outcome. The cooperation content, implementation steps, resource investment, transaction structure, and commercial terms under each key area will be separately negotiated by the Parties based on actual project maturity, and shall be subject to formal written agreements subsequently signed by both Parties. Whether and when subsequent agreements can be signed involves significant uncertainty. As of the date of the announcement, the TGV advanced packaging business has not had a material impact on the company's operating performance.

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