AI Chip Concept Stocks Watch丨ASMPT (00522.HK) Fluctuates Down Nearly 1%, Strong Performance in Domestic Chip Industry Chain Validates Sector Boom

NewTimeSpace (newtimespace.com) reported that on July 22, 2026, the chip theme showed choppy trading, with ASMPT (00522.HK) turning from gains to losses. As of 13:26, the stock was quoted at HKD 170.300, down 0.82%.

NewTimeSpace (newtimespace.com) reported that on July 22, 2026, the chip theme showed choppy trading, with ASMPT (00522.HK) turning from gains to losses. As of 13:26, the stock was quoted at HKD 170.300, down 0.82%.

On the news front, data showed that as of July 21, 45 semiconductor companies had disclosed their first‑half performance forecasts, with 42 reporting profits and 39 posting year‑on‑year growth in net profit attributable to parent companies. A number of domestic chip industry chain companies reported significant pre‑announced increases in semi‑annual results, validating the sector's strong boom.

Additionally, a Tencent Cloud executive recently stated at a sub‑forum of the World Artificial Intelligence Conference that to drive inference costs to an extreme low, the company will deploy domestically produced computing power at scale, with plans to deploy NPO (Near‑Package Optics) superserver nodes in the fourth quarter of 2026, and called for the unification of NPO industry standards both domestically and internationally.

CITIC Securities stated that from scarce advanced process manufacturing capabilities to a broad array of design firms, and on to superserver nodes, all are expected to see volume growth opportunities. At the same time, advanced processes, advanced packaging, advanced memory, and the supporting industrial chain are poised for strong growth momentum. Visibility of domestic computing power orders has significantly improved, supply chain stocking rhythms are accelerating, and the financial results of relevant companies are expected to show marked improvement.

ASMPT(00522.HK)Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

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