TONGBO files for listing on HKEX: the world's 10th largest electrolytic copper foil producer by 2025 sales volume
NewTimeSpace News: On 31 August 2026, Jiangxi Tongbo Technology Co., Ltd. filed its listing application with the Hong Kong Stock Exchange, with Sinolink Securities (Hong Kong) Co., Ltd. acting as the sole sponsor. The Company is an electrolytic copper foil solutions provider in China, focusing on the design, R&D, production and sales of high-performance electrolytic copper foil, with its revenue mainly derived from the sales of lithium battery copper foil and electronic circuit copper foil products during the track record period.
According to Frost & Sullivan, by sales volume in 2025, the Company was the world's 10th largest electrolytic copper foil producer, with a market share of approximately 2.3%. In view of the upward trend and strong demand from downstream industries such as artificial intelligence and high-performance computing, the Group is strategically focusing on electronic circuit copper foil products such as reverse-treated foil (RTF) and ultra-low profile foil (HVLP), which it expects to become a key growth driver of its future business.
The Group supplies lithium battery copper foil, a key component of lithium batteries used in new energy vehicles (NEV), energy storage systems (ESS) and consumer electronics, as well as advanced electronic circuit copper foil essential for the manufacture of printed circuit boards (PCB) and copper clad laminates (CCL), serving markets including AI and high-performance computing, 5G/6G communications, consumer and automotive electronics, and commercial aerospace. In addition, the Group supplies RTF and HVLP products to a number of leading domestic PCB and CCL manufacturers targeting the AI and high-performance computing industry, and has sent samples of a new negative electrode current collector designed for solid-state and semi-solid-state batteries to leading global battery manufacturers.
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