Allystar Makes Third HKEX Listing Application; Ranks Fifth Globally in GNSS Chip & Module Market

NewTimeSpace News: Allystar Technology (Shenzhen) Co., Ltd. submitted its third listing application to HKEX on 26 June, with CMB International and Ping An Securities (Hong Kong) Limited acting as joint sponsors. According to CIC Consulting data, by shipment volume in 2025, the Company ranked fifth in the global GNSS chip and module market with a 7.4% market share; by revenue, it stood seventh worldwide and second among mainland Chinese enterprises in the dedicated GNSS chip and module segment, capturing approximately 1.8% market share.
NewTimeSpace News: Allystar Technology (Shenzhen) Co., Ltd. filed its third listing application with The Stock Exchange of Hong Kong Limited on 26 June 2026, jointly sponsored by CMB International Capital Corporation Limited and Ping An Securities (Hong Kong) Limited.
Headquartered in Shenzhen, the Company is a well-known Chinese space positioning service provider, offering chips, modules and comprehensive solutions compatible with major GNSS systems including BDS, GPS, GLONASS, Galileo, QZSS and NavIC. Its dedicated R&D team focuses on GNSS technologies, covering high-integration SoC chip design, chip-level dual-frequency high-precision positioning, ultra-low power consumption and multi-source fusion navigation technologies.
Per research from CIC Consulting, based on 2025 shipment volumes, the Company secured the fifth position across the global GNSS chip and module market with a 7.4% market share. Measured by revenue in the dedicated GNSS chip and module market (excluding integrated GNSS chips and modules), it ranked seventh globally and second among all mainland Chinese players, holding around 1.8% market share.
The Group maintains a comprehensive product portfolio comprising self-developed GNSS chips, modules, customised vertical industry solutions, as well as third-party sourced chips and modules. Its core products serve multiple sectors: transportation (traffic management, shared mobility, intelligent driving), consumer electronics (smartphones, IoT, wearables), environmental monitoring and early warning (meteorological detection, deformation monitoring).

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