AI Chip Concept Stocks Watch丨ASMPT (00522.HK) Surges Over 10%, South Korea Announces Nearly Quadrillion Won Investment in Semiconductors, AI, etc.

NewTimespace (newtimespace.com) reported that on June 30, 2026, the semiconductor theme strengthened, with ASMPT (00522.HK) surging sharply in volatile trading. As of 13:55, the company's stock was quoted at HKD 243.000, up 11.98%.

NewTimespace (newtimespace.com) reported that on June 30, 2026, the semiconductor theme strengthened, with ASMPT (00522.HK) surging sharply in volatile trading. As of 13:55, the company's stock was quoted at HKD 243.000, up 11.98%.

On the news front, South Korea announced a government investment plan and support package totaling nearly 1 quadrillion Korean won for semiconductors, physical AI, and AI data centers. South Korea will invest 800 trillion Korean won (approximately RMB 3.52 trillion) to build four memory chip wafer fabrication plants in the southwestern Gwangju and Jeolla regions, creating the country's second-largest semiconductor cluster after the capital area. Among this, Samsung Electronics and SK Hynix will jointly contribute 81 trillion Korean won to establish an advanced packaging base in Chungcheong Province, specifically to accommodate supporting needs for the expansion of AI high-bandwidth memory (HBM) production.

Everbright Securities stated that, considering the smooth progress of TCB and HB equipment, the commencement of shipments for HBM4 and 16‑layer/20‑layer HBM will further strengthen the demand outlook for TCB. ASMPT is actively expanding its customer base for advanced packaging in memory and logic, and the firm is optimistic about the long‑term contribution of the advanced packaging business to boosting performance and valuation.

ASMPT (00522.HK)Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

NewTimeSpace Disclaimer: All content herein is the original work of NewTimeSpace. Any reproduction, reprinting, or use of this content in any other manner must clearly indicate the source as "NewTimeSpace". NewTimeSpace and its authorized third-party information providers strive to ensure the accuracy and reliability of the data, but do not guarantee the absolute correctness thereof. This content is for reference only and does not constitute any investment advice. All transaction risks shall be borne by the user.

×
Share to WeChat

Open WeChat, use the "Scan", and share to my Moments.