AI Chip Concept Stocks Watch | Micron Technology's Better-than-Expected Earnings Inject Industry Confidence; ASMPT (00522.HK) Opens Higher and Fluctuates

NewTimeSpace (newtimespace.com) News: On June 25, 2026, the chip sector continued to strengthen. ASMPT(00522.HK) opened higher and fluctuated. As of 13:38 PM, the company's share price was quoted at HK$202.200, up 0.70%.

NewTimeSpace (newtimespace.com) News: On June 25, 2026, the chip sector continued to strengthen. ASMPT(00522.HK) opened higher and fluctuated. As of 13:38 PM, the company's share price was quoted at HK$202.200, up 0.70%.

On the news front, on June 25, semiconductor enterprise Micron Technology (MU) announced its fiscal third quarter 2026 financial results (for the period ended May 28, 2026) after the market close. During the period, Micron achieved a revenue of USD 41.46 billion, representing a quarter-on-quarter increase of 73.8% and a year-on-year increase of 345.7%, far exceeding the market expectation of USD 35.84 billion.

Guosen Securities pointed out that AI demand is driving up memory demand, and overseas original equipment manufacturers (OEMs) are focusing on high-value-added server products. The spillover of demand and the demand for localization have opened up opportunities for domestic enterprises to capture market windows and increase penetration rates among smartphone brands. Along with the restructuring of the industrial chain division of labor, domestic memory manufacturers are expected to achieve a virtuous cycle of earnings growth, accelerated customer onboarding, and product structure upgrades during this upward cycle. Furthermore, with the exit of overseas manufacturers, domestic niche memory manufacturers are poised to capture the demand dividends in markets such as 2D NAND and niche DRAM, and the high prosperity of the industry currently persists.

ASMPT (00522.HK)Engages in R&D and global sales of semiconductor assembly and packaging equipment, advanced packaging equipment, and surface mount technology. Its 2.5D/3D advanced packaging tools, such as thermo-compression bonding (TCB) machines, have been delivered to multiple leading OSATs, IDMs, and memory manufacturers worldwide for volume production of HBM and chiplet-based chips. The company has publicly disclosed multiple follow-on orders from AI-compute related customers.

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