STAR Market Margin Balance Rises for 9th Straight Day! Premia China STAR50 ETF (03151.HK) Surges Over 2% Intraday, Hua Hong Semiconductor Leads Gains

NewTimeSpace News –Recently, the STAR Market has delivered standout earnings, with tech-themed sectors remaining active. The margin balance of the STAR Market has risen for nine consecutive trading days. Wind data shows that as of April 17, the combined margin balance on the STAR Market reached RMB 309.664 billion, up RMB 1.121 billion from the previous trading day, marking the ninth straight day of increases.Premia China STAR50 ETF(03151.HK) surged over 2% intraday, with cumulative gains exceeding 8% over the past five trading sessions.

According to HKEX data,Premia China STAR50 ETF(03151.HK) tracks the STAR 50 Index, which comprises the 50 largest and most liquid stocks on the STAR Market. The index exhibits pronounced "hard tech" leadership characteristics, with semiconductor names accounting for over 65% of its weight. Together with medical devices, software development, and photovoltaic equipment, the top four sectors represent nearly 80% of the index.

Semiconductor chips carry the heaviest weight at approximately 31%, followed by computer applications, special-purpose equipment, chemical products, and biopharmaceuticals. The top three industries alone account for over 86% of the index, aligning closely with the national "Technology Empowers the Nation" strategic direction.

On the news front, ASML reported Q1 2026 revenue of EUR 8.77 billion, up 13% year-on-year, and net profit of EUR 2.76 billion, up 17%. Driven by surging AI infrastructure investment, revenue contribution from South Korea jumped from 22% to 45%, becoming the largest regional contributor. The company raised its full-year 2026 net sales guidance to EUR 36–40 billion and plans to deliver at least 60 low-NA EUV systems this year, targeting 80 units in 2027—reflecting a broad-based activation of upstream lithography demand amid global advanced logic and memory chip capacity expansion.

INDUSTRIAL Securities noted that domestic equipment makers continue to achieve breakthroughs and validation in advanced processes. The brokerage believes that "advanced process capacity expansion" will serve as the main thread of independent innovation over the next three years. Additionally, with CoWoS and HBM positioning at the heart of AI industry trends, the importance of advanced packaging will also come to the fore. The firm remains bullish on memory equipment, computing power demand, and the hardware innovation wave driven by on-device AI.

NewTimeSpace Disclaimer: All content herein is the original work of NewTimeSpace. Any reproduction, reprinting, or use of this content in any other manner must clearly indicate the source as "NewTimeSpace". NewTimeSpace and its authorized third-party information providers strive to ensure the accuracy and reliability of the data, but do not guarantee the absolute correctness thereof. This content is for reference only and does not constitute any investment advice. All transaction risks shall be borne by the user.